Baking mold cleaning
Crispy without sticking: Baking mold cleaning with the bakeLINE technology. The cleanLASER ensures clean flat wafer molds during baking without leaving any residue or chemicals.
The two laser optics are installed in the hot oven and clean at operating temperature (>200°C). Consistent wafer quality and taste, minimal additional greasing, no particles and contamination in the product, no interruption for cleaning.